STD17NF03L
| STD17NF03L资料 | |
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STD17NF03L PDF Download |
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File Size : 116 KB
Manufacturer:ST Description:(1) Lead Forming When forming leads, the leads should be bent at a point at least 3mm from the base of the epoxy bulb. Do not use the base of the leadframe as a fulcrum during lead forming. Lead forming should be done before soldering. Do not apply any bending stress to the base of the lead. The stress to the base may damage the BG-LEDs characteristics or it may break the BG-LEDs. When mounting the BG-LEDs onto a printed circuit board, the holes on the circuit board should be exactly aligned with the leads of the BG-LEDs. If the BG-LEDs are mounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade the BG-LEDs. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：STD17NF03L 厂 家：ST 封 装：TO-251 批 号： 数 量：199 说 明：aaa11 |
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运 费：申通快递:15.00元 顺丰快递 20.00元 邮政EMS:23.00元 所在地：汕头市 新旧程度： |
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